| 摘要 |
<p>PURPOSE: To reduce the manufacturing cost of a board for a security card by molding with plastic the board for the card which has a charging recess for an IC chip and in which the bottom wall of the recess is formed of a film wall by an injection molding method. CONSTITUTION: A slide core 15 for forming a charging recess 3 is provided in a mold. After molten resin is charged in a cavity 12, the core 15 is advanced to be moved to the cavity 12. The resin is pushed to be removed in the core 15 by the advancing, and the recess 3 and the wall 6 are simultaneously formed. Accordingly, since the resin is previously charged, even if the wall 6 is thin, no charging failure occurs. It is not necessary to enhance the injecting pressure, and the wall 6 can be effectively molded.</p> |
