| 摘要 |
PURPOSE: To arbitrary change the combination of treating units according to the purpose and, at the same time, to make the maintenance work of the treating units more efficient. CONSTITUTION: A treating device is constituted of at least a heat-treating unit 21 which heat-treats a semiconductor wafer W, a plurality of treating units incorporating cooling units which cool the wafer W, and a housing frame 30 provided with a plurality of housing chambers 31 in which the treating units are respectively housed in removable states where the units can be pulled out of the chambers 31. The connecting sections 28a-28d, 28e-28h, and 28k of operating systems, such as the electric system, air feeding system, exhaust system, control system, etc., which are required for operating the heat-treating unit 21 are provided at the end section of the unit 21 and the connecting sections 32a-32k of the operating sources of the chambers 31 which can be respectively connected to the connecting sections 28a-28k are provided to the chambers 31. Therefore, an arbitrary treating unit can be housed in one housing chamber 31 of the frame 30 and, at the same time, the operating system of the treatment unit can be connected to its operating source. |
