| 摘要 |
PURPOSE: To provide a resonator which has a high plating film adhesive strength and a small dielectric loss by specifying the film thickness of an Ni-P film formed on high frequency dielectric ceramics by electroless plating. CONSTITUTION: The Ni-P film is formed on high frequency dielectric ceramics by electroless plating, and a Cu or Ag film is formed on this Ni-P film as an electrode by electroless plating. The film thickness of this Ni-P film is set to 0.01 to 1.50μm. Thus, the plating film adhesive strength is about 1.0kg/nm<2> with respect to perpendicular tensile stress, and the resonator of high Q is obtained. It is good that they are subjected to heat treatment in the atmosphere of inert gas at <=5500 deg.C after formation of the electrode. |
