| 摘要 |
PURPOSE: To obtain inexpensive, simple, and disconnectable interconnection between conductors in different layers in a multilayered microwave integrated circuit. CONSTITUTION: Interconnection is provided with a grounding surface 56 arranged between first and second layers 52 and 54 respectively supporting first and second conductors 60 and 62 and a coupling slot 64 which is formed in the grounding surface 56 and has a middle section 64A extended in the direction crossing the conductors 60 and 62. The conductors 60 and 62 are connected to each other by electromagnetic coupling. Therefore, the periphery of the interconnecting section is covered with a conductive metal and forms a cavity for preventing the formation of a coupling to an undesirable transmission mode. |
