| 摘要 |
PURPOSE: To form a bump in an accurate position, and shorten the tact time of bump formation. CONSTITUTION: A bonding stage 15 retains a semiconductor element 1 on the upper surface. A chuck mechanism 18 has four positioning segments 19, 20 which are installed on the upper surface of the bonding stage 15, abut against four sides of the semiconductor element 1, and position and clamp it. Bonding mechanism 23 is installed so as to face the surface of the bonding stage 15 which surface retains the semiconductor element 1, presses a ball formed at the tip of a wire 9 against an electrode pad of the semiconductor element 1, and applies ultrasonic vibration to the ball. Thereby the ball is fusion-bonded to the electrode pad. The wire 9 is cut just above the ball, and a ball bump is formed on the electrode pad. |
