| 摘要 |
<p>A radiation-sensitive resin composition containing an alkali-soluble resin, an acid-curable cross-linking agent, and an optical acid generator comprising either (a) a compound of general formula (2) alone or (b) both of a compound of general formula (2) and a compound of general formula (1); and a method of forming a resin pattern on a substrate by using the composition; in formula (2), Y1 to Y4 represent each hydrogen or halogen; in formula (1), X1 to X3 represent each hydrogen or halogen. The composition is excellent in sensitivity and resolution and gives a resin pattern having an excellent form, thus being useful for the production of semiconductor integrated circuits.</p> |
