Package for mounting a semiconductor device

摘要

A package (2) for mounting a semiconductor device (18) comprises a base plate (4), and a conductive layer (12, 14, 16) laminated onto the base plate (4) via an adhesive layer (6, 8, 10). The modulus of elasticity at 25 DEG C of the adhesive layer (6, 8, 10) is 98.07 N/mm<2> (10 kg/mm<2>) or less.