发明名称 Semiconductor arrangement used for large scale integrated circuits
摘要 Semiconductor arrangement has a silicide protective section (8) made up of several insulating layers (81, 82, 83) that covers a gate isolation layer (4), a gate electrode (6) and a side wall (5) covering the side surfaces of the gate insulating layer and the side surfaces of the gate electrode.
申请公布号 FR2778495(A1) 申请公布日期 1999.11.12
申请号 FR19980014151 申请日期 1998.11.10
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 HIRANO YUUICHI;YAMAGUCHI YASUO;MAEGAWA SHIGETO
分类号 H01L21/302;H01L21/3065;H01L21/336;H01L29/78;H01L29/786;(IPC1-7):H01L21/56 主分类号 H01L21/302
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