| 摘要 |
<p>PURPOSE: To prevent the generation of electrically imperfect connection between the bump of a semiconductor chip and a circuit board whose thickness is not uniform or a circuit board wherein flatness between pads is inferior, in the case of the flip chip mounting of a semiconductor chip. CONSTITUTION: This mounting method of a semiconductor chip is constituted by containing a process for forming a dummy pattern 3 for compensating ununiformity of board thickness in a mounting region of a semiconductor chip on a circuit board, or a process for forming bumps different in height for compensating ununiformity of board thickness on a semiconductor chip, or a process for forming a mounting surface 6a which conforms to ununiformity of board thickness on a bonding stage 6 of a bonding equipment, before bonding connection between a pad 1a of a circuit board 1 and a bump 4 of a semiconductor chip 2.</p> |
