Schutzvorrichtung für Halbleiterchipgehäuse von elektrostatischer Entladung

摘要

A plurality of electrostatic discharge (hereafter referred to as "ESD") protection devices are disclosed for use with semiconductor chip packaging (hereafter referred to as "SCP"). The electrostatic protection devices comprise electrically conductive shorting devices that may be removably connected to the SCP during the manufacture to short selected pins from the SCP. The ESD protection devices remain in place to provide ESD protection during all phases of handling and shipping and may be either automatically unshorted or be manually removed during final assembly when the SCP is installed in its end product.