| 摘要 |
PURPOSE:To analyze the correlation between a stress distribution on an LSI chip surface after mold sealing and an LSI characteristic item by providing viscous fluid on the boundary between the die pads and the chip surface before mold sealing. CONSTITUTION:Before mold sealing, viscous fluid 5 is formed in a thin film state by using a viscous fluid generator 6, and an LSI chip surface 1 and a boundary 2 between the die pads are covered with the fluid. After mold sealing, the data of LSI characteristic item is measured, an held in an analyzer 14. The sealing resin on the surface 1 and the boundary 2 between the pads is removed, only the fluidized fluid of the coating fluid 5 is removed by an uneven distribution measuring unit 11, the distribution of the uneven part 12 is measured, and transmitted to the analyzer 14. The uneven distribution data is converted to a stress distribution by the analyzer 14, and the correlation between the distribution data and the item can be analyzed. |
