| 摘要 |
<p>PURPOSE:To fix by vacuum chuck a concavely curved semiconductor wafer by providing three or more suction cups on the spinner head of a spinner device. CONSTITUTION:Sucking holes 10, through which air is sucked, are provided on the center supporting column 11 of a spinner head, and arms 12, having sucking holes 10, are extended in three directions from the supporting column 11, and suction cups 2, by which concavely curved wafers are chucked, are provided on the tip of the arms 12.</p> |
