| 摘要 |
PURPOSE:To reduce the contraction rate at the time of resin curing by a method wherein the thickness of the part of the resin with which a semiconductor chip is sealed is smaller than the thickness of the part of the resin with which fine metal wires are sealed. CONSTITUTION:A semiconductor chip 10 and fine metal wires 11 are sealed with a sealing resin unit 3. The thickness of the part 3a of the sealing resin unit 3 with which the semiconductor chip 10 is sealed is smaller than the thickness of the part 3b of the sealing resin unit 3 with which the fine metal wires 11 are sealed. That is, if the top height of the fine metal wires 11 from the one of the surfaces of a substrate 2 is larger than the top height of the semiconductor chip 10, instead of making the top height of the resin sealing unit 3 from the one of the surfaces of the substrate 2 uniform in accordance with the top height of the fine metal wires 11, the top heights of the respective parts of the resin sealing unit 3 corresponding to the top heights of the fine metal wires 11 and the semiconductor chip 10 are employed. With this constitution, the quantity of the resin required to make the resin sealing unit 3 can be reduced in comparison with the quantity required with a conventional constitution. That is, by reducing the resin quantity of the resin sealing unit 3, the contraction rate of the resin sealing unit 3 at the time of resin curing can be reduced. |
