发明名称 |
Heat conductive material and method for producing the same |
摘要 |
<p>A heat conductive material of high thermal conductivity contains a metal or an alloy which is liquid at room temperature or a fine powder of a heat conductive material dispersed in an organic material which is liquid at room temperature and is used as a cushioning contact material between electronic parts or a circuit substrate carrying electronic parts thereon and a cooling device for cooling the electronic parts or circuit substrate with electronic parts thereon.</p> |
申请公布号 |
EP0696630(A2) |
申请公布日期 |
1996.02.14 |
申请号 |
EP19950303234 |
申请日期 |
1995.05.12 |
申请人 |
FUJITSU LIMITED |
发明人 |
WAKAMURA, MASATO, C/O FUJITSU LIMITED;YAMADA, MITSUTAKA;YAMAGUCHI, JOE;HASHIMOTO, KAORU |
分类号 |
C09K5/08;H01L23/36;H01L23/373;H01L23/42;(IPC1-7):C09K5/00 |
主分类号 |
C09K5/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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