METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE FOR SURFACE MOUNTING, AND SEMICONDUCTOR DEVICE FOR SURFACE MOUNTING

摘要

The invention relates to a method of manufacturing a semiconductor device (1) for surface mounting. According to the invention, the semiconductor devices are packaged while they are still on a slice of semiconductor material, while the package leads are formed from the semiconductor material. In the method according to the invention, the semiconductor devices are manufactured without the necessity of a lead frame, bonding wires, or metal package leads. Thanks to the IC technologies at the wafer level, such as photolithography, etching, etc., the method according to the invention renders possible semiconductor devices of very small dimensions. In addition, integrated circuits with very many package leads can be manufactured in a simple manner without additional steps being necessary. The method according to the invention is thus comparatively inexpensive.