| 摘要 |
PURPOSE:To provide a method for packaging an optical integrated device which improves a yield. CONSTITUTION:A mechanism 16 for detecting the force acting on an optical element 1 at the time of press welding the optical element 1 to a substrate 4 is disposed and the movement of an element moving mechanism 3 is controlled by a control circuit 12 in accordance with the value detected by a force detecting circuit 17 so as to be the force const. As a result, the optical element is packaged on the substrate always under the same conditions and, therefore, the yield is improved and the optical integrated device of a low cost is produced. |
