| 摘要 |
<p>PURPOSE:To improve mounting density by forming thick film resistor on a through hole part provided on a ceramic substrate and connecting both ends of this thick film resistor to the conductors of the surface and the rear so as to use the through hole part as a thick film resistance element and a conduction circuit. CONSTITUTION:The thick film conductors 2 and 5 are provided on both surfaces of a ceramic substrate 3 and a through hole 4 is digged in a desired connecting position of these conductors 2 and 5. Thick film resistance 6 is formed ranging from the inner peripheral surface of the through hole 4 to the conductors 2 and 5 and the thick film resistance 6 is a thick film resistance element while being a conductive circuit of the surface conductor 2 and the rear conductor 2 simultaneously. Consequently, mounting density can be heightened by raising pattern density of the ceramic substrate than before.</p> |
