发明名称 |
Slotted thermal dissipater for a semiconductor package |
摘要 |
An integrated circuit package that contains a heat spreader which has a plurality of legs stamped from a sheet of metal material. The heat spreader also has a plurality of slots which allow plastic to flow between the bonding wires of the integrated circuit assembly during the molded injection process of the package. |
申请公布号 |
US5489805(A) |
申请公布日期 |
1996.02.06 |
申请号 |
US19950457794 |
申请日期 |
1995.06.01 |
申请人 |
INTEL CORPORATION |
发明人 |
HACKITT, DALE;MEHR, BEHROOZ |
分类号 |
H01L21/56;H01L23/433;(IPC1-7):H01L23/34;H01L23/495;H05K7/20 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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