发明名称 BONDER AND BOARD HEATER THEREFOR
摘要 PURPOSE:To enhance productivity by enhancing the operation at the time of switching the type of semiconductor devices being produced. CONSTITUTION:A heater plate 148 abutting against a board L/F and heating the board L/F can be mounted/demounted quickly on/from a heat transmission member, i.e., a heater block 149, through an engaging means 169.
申请公布号 JPH0831882(A) 申请公布日期 1996.02.02
申请号 JP19940188937 申请日期 1994.07.19
申请人 KAIJO CORP 发明人 TORIGOE TOSHIZOU
分类号 H01L21/60;H01L21/603 主分类号 H01L21/60
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