| 摘要 |
<p>PURPOSE:To prevent an abrasion powder from being generated when a wafer and a container are rubbed and to prevent a rattle in the container for transport of wafers. CONSTITUTION:Every groove width of a wafer carrier 2 which is mounted inside a container for transport of wafers is set to be small at 1.2 times or higher and 2 times or lower as large as the thickness of every wafer W as compared with that in conventional cases, and a noncrystalline polyolefin-based plastic in which the performance of a glass transition temperature is at 50 deg.C or higher is used as a molding material for the wafer carrier 2. Thereby, the generation amount of a friction powder and an abrasion powder is reduced to a minimum.</p> |
