| 发明名称 |
Method and apparatus for directly joining a chip to a heat sink |
| 摘要 |
<p>The present invention relates generally to a new apparatus and method for directly joining a chip to a heat sink. More particularly, the invention encompasses an apparatus and a method that uses a double-sided, pressure-sensitive, thermally-conductive adhesive tape to directly join a chip or similar such device to a heat sink. <MATH></p> |
| 申请公布号 |
EP0693780(A2) |
申请公布日期 |
1996.01.24 |
| 申请号 |
EP19950480065 |
申请日期 |
1995.05.19 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CALL, ANSON JAY;MEISNER, STEPHEN H.;POMPEO FRANK LOUIS;ZITZ, JEFFREY ALLEN |
| 分类号 |
H01L23/40;H01L21/58;H01L23/367;H01L23/42;H01L23/498;H01L23/64;(IPC1-7):H01L23/433 |
主分类号 |
H01L23/40 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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