Verfahren zur Herstellung elektronischer Packungen und intelligente Strukturen durch thermisches Sprühen.

摘要

A smart structure or an electronic package is formed by thermal spraying utilizing a plurality of masks positioned and removed over a work surface in accordance with a predetermined sequence. The masks correspond to cross sections normal to a centerline through the structure. The masks are placed above a work surface and sprayed with a primary material to build up at least one electronic component, or with a complementary material. In this manner, layers of material are formed, each layer comprising at least one primary material and at least one complementary material. Then, any complementary material deposited merely to serve as a support structure during forming may be removed.