Moulding resin contg. a high filler loading

摘要

A molding resin composition contains a filler comprising a globular powder of which mean particle diameter is not smaller than 0.1 mu m and not greater than 1.5 mu m (x component), a globular powder of which mean particle diameter is not smaller than 2 mm and not greater than 15 mu m (y component) and a globular powder of which mean particle diameter is not smaller than 20 mu m and not greater than 70 mu m (z component), wherein proportions of the x, y and z components based on the total volume of x, y and z components are not smaller than 10% by volume and not greater than 24% by volume, not smaller than 0.1% by volume and not greater than 36% by volume and not smaller than 57% by volume and not greater than 76% by volume and exhibits an excellent fluidity even when loaded with a high percentage of filler. A semi-conductor package sealed with the resin composition exhibits a high package crack resistance.