| 摘要 |
<p>A notch of a wafer is chamfered by a method which is characterized by disposing a rotary disklike grindstone and a wafer to be ground with the disklike grindstone in such a manner that the surfaces thereof intersect each other, relatively moving the grindstone and the wafer toward or away from each other, and meanwhile rotating the wafer within a prescribed angle around the central axis perpendicular to the surface of the wafer thereby effecting a work of chamfering the notch of the wafer in the circumferential direction and/or in the direction of thickness of the wafer. The chamfering is accomplished with an apparatus which comprises a rotating disklike grindstone, a wafer retaining mechanism capable of disposing a wafer and the grindstone in such a manner that the surfaces thereof intersect each other and, at the same time, retaining the wafer in such a manner as to be rotated around the central axis perpendicular to the surface of the wafer, a first drive mechanism for relatively moving the grindstone and the wafer toward or away from each other, a second drive mechanism for relatively moving the grindstone and the wafer in the direction of thickness of the wafer, and a control circuit capable of controlling the motions of the wafer retaining mechanism, the first drive mechanism, and the second drive mechanism thereby effecting the work of chamfering the notch of the wafer in the circumferential direction and/or in the direction of thickness of the wafer. <IMAGE></p> |
