发明名称 Method for applying or removing coatings at a confined peripheral region of a substrate
摘要 A method for applying or removing coatings at a confined peripheral region of a substrate to produce on a front surface of the substrate an interior unprocessed region surrounded by an outer processed region. According to the method, a guide member is positioned in adjacent facing relation to the front surface of the substrate and the guide member is formed with a central portion and a raised peripheral portion offset from the central portion. The central portion of the guide member faces and corresponds to a region of the substrate not to be processed, while the peripheral portion of the guide member faces and corresponds to an outer region of the substrate which is to be processed. The peripheral portion of the guide member is closer to the substrate and forms a gap with the opposed region of the substrate, which is less than a space formed between the central portion of the guide member and the opposed region of the substrate. A processing solution is introduced into the gap by spinning the guide member and the substrate together about a substantially vertical axis which keeps the processing solution confined to the gap by surface tension of the processing solution to achieve processing only of the outer region of the substrate while the central region of the substrate remains unprocessed.
申请公布号 US5474807(A) 申请公布日期 1995.12.12
申请号 US19930128541 申请日期 1993.09.28
申请人 HOYA CORPORATION 发明人 KOSHIISHI, KUNIHIKO
分类号 B05D1/00;G03F1/00;G03F1/14;G03F7/16;H01L21/00;(IPC1-7):B05D3/12 主分类号 B05D1/00
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