| 摘要 |
<p>An enclosed semiconductor wafer holder (10), and a cover (24) providing isolation control of semiconductor wafers that is simple, lower cost, and non-obtrusive is described. The cover includes a sealing perimeter (82) that creates a hermetic seal when engaged with the semiconductor wafer holder. It also includes purging bores (53) that allow an active gentle purging of inert gas into the sealed semiconductor wafer holder. The holder has contoured recess-forming pairs (44a-t, 46a-t) that do not effect semiconductor wafer transfer when the recess forming pairs are warped. The recess-forming pairs also have integrally corresponding ribs (100a-t) that help prevent warpage of the contoured recess-forming pairs during the plastic injection molding process.</p> |
