Semiconductor device having semiconductor chip bonded to circuit board through bumps and process of mounting thereof.

摘要

Conductive leads (13) are connected at inner ends thereof to electrodes (11a) of a semiconductor chip (11) through a tape-automated bonding process, and bumps (18) are formed on the other ends (13b) of the conductive leads (13) so as to economically and reliably mount the semiconductor chip (11) on a circuit board (19a/19b) through a concurrent reflow.