| 摘要 |
PURPOSE:To protect a multilayered wiring ceramic board against cracking generated around a via by a method wherein resin is filled in an interfacial gap between a via conductor and ceramic. CONSTITUTION:When a multilayered wiring ceramic board which is equipped with a via conductor 1 of Ag and a glass ceramic board 2 formed of borosilicate glass and alumina and has a permittivity of 7.1 is burned at a temperature of 900 deg.C in an N2 atmosphere, a gap occurs at an interface between a via and a board 2, and no cracks are generated in the board 2. A pattern is formed on the surface of the board by sputtering or plating, and polyimide 3 is applied and cured. If a resin layer is provided between a via conductor and ceramic after burning, as resin is elastic, cracks are prevented from occurring in ceramic around a via in an after process due to a thermal expansion coefficient difference between conductor and ceramic. |
