发明名称 Silicone pressure sensitive adhesive compositions having high solids content.
摘要 <p>A solventless or high solids-containing organopolysiloxane composition curable to produce a pressure sensitive adhesive having high tack and high peel adhesion, comprising (A) a toluene soluble, resinous copolymer comprising R3SiO1/2 units and SiO4/2 units; (B) an alkenyl-terminated polydiorganosiloxane having a viscosity of from about 10 to about 500 centipoise at 25 DEG C; (C) from 0 to about 90 mole % of a hydride-terminated organohydrogenpolysiloxane having a viscosity of from about 10 to about 1000 centipoise at 25 DEG C; (D) from about 10 to about 100 mole % of a hydrogen-containing polydiorganosiloxane crosslinking agent; the combined average hydride equivalent weight of (C) and (D) being at least 1500 grams/silicon-bonded hydrogen atom; the mole percentages of (C) and (D) being based on the total silicon-bonded hydrogen content of (C) and (D); the total of (B), (C) and (D) being from about 25 to about 50 parts by weight; the total of (A), (B), (C) and (D) being 100 parts by weight; the ratio of silicon-bonded hydrogen atoms in (C) and (D) to olefinically unsaturated radicals in the total of (A) and (B) being in the range of from about 1.1:1 to about 15.0:1; (E) a catalytic amount of a hydrosilation catalyst; and (F) from 0 to about 40% by weight of an organic solvent.</p>
申请公布号 EP0506370(B1) 申请公布日期 1995.11.15
申请号 EP19920302582 申请日期 1992.03.25
申请人 GENERAL ELECTRIC COMPANY 发明人 LIN, SHAOW BURN
分类号 C09J183/00;C09D183/07;C09J183/04;C09J183/07;(IPC1-7):C09J183/07 主分类号 C09J183/00
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