| 摘要 |
PURPOSE: To perform polishing efficiently irrespective of type of wafer and flatten and treat a thin film of a semiconductor substrate by rotating a table and a pad for polishing relatively to form a groove in the pad for polishing and introducing slurry into this groove when the thin film of the semiconductor substrate is polished. CONSTITUTION: A surface of a pad 21 for polishing is filled with a plurality of peripheral grooves 47 prior to polishing work to perform initial adjustment. During polishing work, a carrier 23 which is a keel is rotated by a shaft 22 and a table 20 is rotated. At this time, slurry is supplied onto the surface of the pad for polishing 21 to embed slurry particles on the surface of the pad 21 for polishing, and a thin film is polished by relative rotation of the table 20 and the carrier 23. On the other hand, at the time of polishing, a diamond block holder 36 crosses a peripheral groove 47 of the pad 21 for polishing at a turn point 52 through an arm 32 for adjustment for sweeping. Consequently, it crosses a passage region 42 of the peripheral groove 47 to form a micro channel groove 50. |
