| 摘要 |
PURPOSE:To improve the heat radiation quality of a film for mounting a semiconductor element thereon, by connecting through first leads a plurality of terminals made of solder respectively with a plurality of first electrodes formed in the peripheries of the central region of the film, and by connecting the first electrodes respectively with second electrodes of the semiconductor element formed on the opposite surface of the film to the terminals made of solders. CONSTITUTION:In a film 1 for mounting a semiconductor element 9 thereon, a circuit pattern 4 is formed on one side of an insulation film 2. Lead parts 5 are connected respectively with metallic protrusions 11 provided on external connection electrodes 10 of the element 9. Inside the lead parts 5, form slder balls 8 formed in the central region of the insulation film 2 are provided respectively in the respective end parts of the circuit pattern 4 connected respectively with the lead parts 5. The metallic protrusions 11 formed on the external connection electrodes 10 of the semiconductor element 9 and the lead parts 5 are aligned with each other, and then, they are connected with each other by a thermocompression bonding method, etc. Thereby, a heat radiation structure having a high freedom can be adopted on the film 1. |
