| 发明名称 |
Chip carrier |
| 摘要 |
{PG,1 An improved chip carrier of thin dieletric deformed into a dish configuration provided with flexible mounting flanges on which are plated or bonded solderable conductive traces and paths together with plated or bonded heat sinks which may be referenced to ground potential, and which provides structural integrity.
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| 申请公布号 |
US4147889(A) |
申请公布日期 |
1979.04.03 |
| 申请号 |
US19780882300 |
申请日期 |
1978.02.28 |
| 申请人 |
AMP INCORPORATED |
发明人 |
ANDREWS, DANIEL M.;MERLINA, JOSEPH F.;REDMOND, JOHN P.;SCHEINGOLD, WILLIAM S.;ULBRICH, GEORGE |
| 分类号 |
H05K1/18;H01L21/60;H01L23/14;H01L23/367;H01L23/495;H01L23/498;H01L23/50;(IPC1-7):H05K7/20 |
主分类号 |
H05K1/18 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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