| 摘要 |
PURPOSE: To facilitate the removal of a sensor from a substrate, to prevent its breakage and reduce manufacturing period and cost by evacuating an insulat ed thin-film base layer using a thin-film layer of an adhesive, formed on the periphery of a substrate to adhere the base layer to the substrate and forming a thin-film sensor thereon. CONSTITUTION: A thin-film layer 30 of a curable adhesive is applied onto the periphery of a substrate 12 with a closed loop pattern, an insulated thin-film base 16 is placed thereon with adhering its edges to the layer 30, and they are heated and pressurized in a press in order to cure the adhesive. During this curing process, air and gas components are discharged from a cavity 32 to evacuate the central part of the base layer 16 and to adhere the base layer 16 to the flat upper surface of the substrate 12. After that, the base layer 16 is coated with a thin-film conductor layer, and an electrochemical sensor 10 is formed thereon by a photolithographic mask and the etching method. Since the sensor 10 physically adhers to the substrate 12 but does not bond directly, by cutting the surroundings of the sensor 10, it can be removed from the substrate 12 quickly and easily, to prevent breakage. |
