| 摘要 |
PURPOSE:To obtain a wire bonding device which is easily started up and capable of stably carrying out a wire looping operation. CONSTITUTION:The height of each edge upper loop of a bonding wire is obtained by a first operator section 12 when a loop is formed corresponding to a loop height. The form of each wire loop is determined on the basis of the height of the edge upper loop and a standard value through a second operator section 13, and a looping parameter of each wire is automatically set. Thereafter, a reverse height and a reverse rate and a rise of a capillary are calculated in accordance with parameters. By this setup, a capillary 20 is controlled in movement by a control 15, whereby a bonding wire possessed of a loop optimal in height and form can be formed. |
