| 摘要 |
<p>PURPOSE:To reinforce a GND line and to eliminate the need for the GND layer of a printed wiring board by electrically connecting the GND pin of an LSI package mounted on the printed wiring board to a housing through a conductive member. CONSTITUTION:The printed wiring board 3 mounted with the LSI package 2 is stored in the housing consisting of a metallic plate 6 such as an Al thin plate and a core 7. The metallic plate 6 is adhered to the core 7 through, for example, a heat-pressing bonding sheet. This memory card 1a is constituted by bending the GND pin among pin (lead) constituting the external terminals of the LSI package 2 mounted on the printed wiring board 3 toward the metallic plate 6 and directly connecting its tip to the reverse surface of the metallic plate 6. In this case, the GND pin and the reverse surface of the metallic pin 6 are coated with solder paste in advance, and the temperature of the heat- pressing bonding of the metallic plate 6 to the core 7 is set to the fusion temperature of solder, thereby soldering the pin to the reverse surface of the metallic plate 6.</p> |
