| 摘要 |
<p>PURPOSE:To make a semiconductor wafer thin by grinding its rear keeping it high in mechanical and physical strength even if it is large in diameter by a method wherein the semiconductor wafer is divided into a few pieces before its rear is ground. CONSTITUTION:A semiconductor wafer 1 previously subjected to an element circuit forming process is subjected to a final check, and then chips are subjected to a testing process. After testing, the semiconductor wafer 1 is divided into a few pieces by cutting. The wafer 1 is cut by a diamond cutter through a scribing method or by a laser cutter through a fusion cutting method or by a diamond grinding stone through a dicing method, and the semiconductor wafer 1 is divided into four pieces. After the wafer 1 is cut, the element circuit forming surface of the wafer 1 is pasted on a fixing member 3 and fixed, and the rear of the semiconductor wafer 1 is ground by a grinder 2. The semiconductor wafer 1 split into four pieces is set on a grinder 2 and ground optional in thickness.</p> |
