发明名称 INJECTION MOLDING DEVICE
摘要 PURPOSE:To prevent deformation and lowering of strength of a molded piece due to fiber orientation by adjusting a thickness of a resin material which flows in a diffusion area so as to minimize the deformation of the molded piece due to the fiber orientation in the resin flowing in a cavity. CONSTITUTION:An analyzing/calculating program is provided in a computer 10. The analyzing/calculating program calculates information for controlling a thickness adjusting pin 4 which changes a thickness of a resin material 1 flowing in a diffusion area 9 ranging from parts just under gates 5 to a plate flow area. By the analyzing/calculating program, the thickness of the resin material at the cavity 6 in the diffusion flow area, which minimizes deformation of a molded piece due to fiber orientation in the resin material 1 flowing in the cavity 6, is obtained. A driving section of the thickness adjusting pin 4 moves the thickness adjusting pin 4 up and down so as to make the thickness of the resin material a required value.
申请公布号 JPH07276434(A) 申请公布日期 1995.10.24
申请号 JP19940070602 申请日期 1994.04.08
申请人 SEKISUI CHEM CO LTD 发明人 SUZUKI HIROYUKI
分类号 B29C45/26;B29C45/00;B29C45/08;B29C45/56;B29C45/80;B29K105/12;(IPC1-7):B29C45/26 主分类号 B29C45/26
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