| 发明名称 |
METALLIZED SUBSTRATE FOR ELECTRONIC DEVICE |
| 摘要 |
Metallizing pastes, for forming thick film circuitry on low expansion substrates in electronic devices, are disclosed. The paste contains a glass powder that crystallizes on firing to a glass-ceramic in which lead titanate is the primary crystal phase. |
| 申请公布号 |
CA1337376(C) |
申请公布日期 |
1995.10.24 |
| 申请号 |
CA19890610720 |
申请日期 |
1989.09.08 |
| 申请人 |
CORNING INCORPORATED |
发明人 |
FRANCIS, GAYLORD LEE;MARTIN, FRANCIS WILLIS |
| 分类号 |
C03C8/18;B32B18/00;C03C10/00;H01B1/22;H01B5/00;H01B5/14;H01B13/00;H01L23/498;H05K1/09;(IPC1-7):H01L23/498;H01L21/48 |
主分类号 |
C03C8/18 |
| 代理机构 |
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代理人 |
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