发明名称 ELECTRONIC PART MOUNTING SUBSTRATE AND MANUFACTURING METHOD THEREOF
摘要 PURPOSE:To enable the connecting pad in not less than two rows to be arranged at narrow pitch as well as the electrical characteristics of the connecting pad in the other row to be equalized with one another. CONSTITUTION:Inner and outer pads 5 and 6 are arranged in two rows around an electronic part mounting part 3 together with the first conductor layer 7 on a substrate 2 and the second conductor layer 8 positioned on the first conductor layer 7 through the intermediary of an insulating layer 8. On the other hand, the pad 6 in the outside row is formed of the second conductor layer while the other pad 5 in the inner side row is formed of the third conductor layer laminatedly formed in the first aperture part 9 provided in the insulating layer 8. In such a constitution, the inner pad 5 and the outer pad 6 are not formed in the same layer thereby enabling the outer pad 6 to be formed on a narrow pitch while the inner pad 5 to be formed on the first conductor layer 7 not through the intermediary of a through hole.
申请公布号 JPH07273459(A) 申请公布日期 1995.10.20
申请号 JP19940059480 申请日期 1994.03.29
申请人 IBIDEN CO LTD 发明人 DEMURA AKIHIRO
分类号 H05K3/46;H01L21/60;H01L23/12 主分类号 H05K3/46
代理机构 代理人
主权项
地址
您可能感兴趣的专利