| 摘要 |
PURPOSE:To eliminate the generation of the warp of a substrate and to enhance the reliability of a bump connection part by a structure wherein a flat boardlike cover is supported by a pillar so as not to come into contact with a semiconductor chip which is flip-chip-mounted on a board. CONSTITUTION:A semiconductor chip 3 is flip-chip-mounted on a glass epoxy board 1 by bumps 5. Then, a cover-fixing pillar part 7 for an aluminum cover 6 is attached to the board 1 by an adhesive 8, and the cover-fixing pillar part 7 is installed in the center of the board 1. Thereby, a stress generated due to the difference in a coefficient of thermal expansion between the aluminum cover 6 and the board 1 can be reduced to a minimum. Consequently, the warp of the board due to the hardening and contraction in the curing operation of a cover resin is not generated, a stress is not applied to bump connection parts, and the reliability of a connection is enhanced. In addition, since the surface of the cover 6 is flat, a module can be sucked easily by a mounting machine when it is mounted on a motherboard, and it can be mounted precisely.
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