SELECTIVE PLASMA DEPOSITION

摘要

A selective area deposition on a substrate surface having a separate areas of different materials comprises forming a plasma (optionally ignited by filament (35)) over the substrate (37) on pedestal (16) and insulator (17), injecting coating species into the plasma by either sputtering from source (26) or gaseous injection, adding a reactive gas via inlet (33) for altering surface binding energy at the coating surface, and biasing (19, 21) the substrate during deposition to bombard the substrate with ionic species from the plasma. Surface binding energy is altered differently for the separate areas, enhancing selectivity. Bias power is controlled to exploit the alteration in surface binding energy. For gaseous injection of the coating species, and in some cases of sputtering of the coating material, the temperature of the substrate surface is controlled (23, 24, 25) also. In an alternative embodiment, selectivity is to phase of the coating material rather than to specific areas on the substrate, and a selected phase may be preferentially deposited on the substrate.