发明名称 |
Integrated circuit package with flat topped heat sink. |
摘要 |
<p>An integrated circuit package is disclosed, of the type having a pin-fin heat sink attached to the surface. A flat plate is attached to the ends of the pins of the heat sink, to provide a planar surface area of adequate size to allow a vacuum pickup tool to pick and place the packaged integrated circuit, and to receive marking and symbolization. <IMAGE> <IMAGE></p> |
申请公布号 |
EP0675538(A2) |
申请公布日期 |
1995.10.04 |
申请号 |
EP19940308868 |
申请日期 |
1994.11.30 |
申请人 |
SGS-THOMSON MICROELECTRONICS, INC. |
发明人 |
HUNDT, MICHAEL J. |
分类号 |
H01L23/36;H01L23/00;H01L23/367;H01L23/40;H01L23/544;(IPC1-7):H01L23/367 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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