| 摘要 |
A novel lid for sealing an encapsulant within a cavity of an integrated circuit package is disclosed herein. A ring is formed around a cavity opening, where a semiconductor die is located in an integrated circuit package. A lid, having a radially extending potion biased toward the die, is adapted to engage the cavity opening. According to one embodiment of the invention, a dam ring is disposed on the top surface of an integrated circuit package so as to form the cavity opening. A radially extending potion of the lid is adapted to engage the inner or outer surface of the ring so as to retain the lid in close communication with the cavity opening and seal the encapsulant within the cavity. Alternatively, the lid can be adapted to engage the cavity opening as existing in the top surface of an integrated circuit package. The present invention is especially advantageous in conjunction with ball grid array ("BGA") packages and pin grid array ("PGA") type IC packages.
|
