Improved semiconductor wafer carrier and method.

摘要

An improved semiconductor wafer carrier provides gimballing motion of the wafer to dynamically align the wafer to a polishing platen. This gimballing motion is achieved by providing a conical receptacle which has a spring friction fit with a spherical button. A torque plate with spring fingers provides the spring friction fit between the conical receptacle on the rotating shaft and the spherical button on the drive plate of the wafer carrier.