| 摘要 |
PURPOSE:To realize a compact device and to enable improvement of wettability of a pellet. CONSTITUTION:A die bonding device 20 is provided with a pellet unloading mechanism 25 for unloading a pellet 22 from a wafer 21, a pellet position correcting mechanism 26 by mounting the unloaded pellet on a gauging stand 32 and a bonding mechanism 27 for bonding the pellet whose position is corrected to a lead frame 23 by using paste 42. Therefore, a paste containing part 33 which enables charge of paste is formed in a gauging stand and a pallet unloading by a pellet unloading mechanism can be mounted on a paste surface inside a paste containing part.
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