| 摘要 |
<p>At least one electronic element (12) is ultrasonically welded to a printed circuit board (10) to create the electronic circuit. Proper alignment between terminals of a conductive circuit pattern (14) on the circuit board and terminal units (20) on the connecting surface of the electronic element is ensured by a variety of techniques: (i) small protuberances (22) on the terminal units, (ii) raised section (26) on the bottom surface of the terminal units placed to engage indented portions of the board, and (iii) corresponding posts (36) (on the electronic elements) and holes (41) (formed on the circuit board). The ultrasonic welding of the element to the printed circuit board is typically conducted at a frequency range between 25-30 megahertz which produces a vibration which grinds the terminal units of the electronic element to the terminals of the circuit pattern while also welding the element and circuit board together. Electronic circuits formed in accordance with the inventive concept disclosed herein can be comprised of stacked or interlocking combinations of weldable electronic elements. Such structures can improve rigidity and vary spacial relationships of electronic circuits. <IMAGE></p> |
