| 摘要 |
<p>A method for manufacturing a package, a device for manufacturing the package, a package and a part for such a package are described. The package is preferably a blister package which consists of a cardboard back plate (11) and a plastic film hood releasably connected to the latter. The cardboard back plate (11) contains recesses, through which projections (20) of the film hood pass. The projections (20) have a floor section (26). The cardboard back plate (11) and the film hood are joined in such a way that the projections (20) pass through the recesses and project above them in sections. The projecting sections are reshaped to make tori which grip round the recesses of the cardboard back plate (11). The material of the floor section (26) is reshaped in a plane parallel to the plane of the cardboard back plate (11) to make the tori larger. This is preferably carried out by tearing open the floor section (26) using a pointed stamp (36), so that the previously level floor section (26) stands upright like a sleeve and can then be reshaped to form widened beads using a heating and crusher tool (43). <IMAGE></p> |
