Silicon-containing polyamic acid derivative and photosensitive resin composition using it

摘要

The present invention provides a silicon-containing polyamic acid derivative which is represented by the formula (VI) XkR3-k5Si (VI) and which has a logarithmic viscosity number of 0.1 to 5.0 dl/g at 30 DEG C. in N-methyl-2-pyrrolidone, said silicon-containing polyamic acid derivative being obtained by reacting A mol of a tetracarboxylic acid derivative, B mol of a diamine, and C mol of an aminosilicon compound so as to meet the relations of the equations (IV) and (V): (IV) (V) A photosensitive resin composition using this silicon-containing polyamic acid derivative can be easily manufactured, permits the formation of a negative type sharp relief pattern, can inhibit film reduction at the time of curing by baking, and is excellent in adhesive properties to substrates, heat stability and shelf stability.