发明名称 |
Positive photo-sensitive resin composition comprising a photosensitive polybenzoxazole or a mixture of a polybenzoxazole, an organic solvent soluble polymer and a diazoquinone and/or a dihydropyridine compound |
摘要 |
The present invention provides a positive photo-sensitive resin composition comprising a polybenzoxazole precursor as a base resin, an organic solvent-soluble polymer or its precursor (e.g., a polyamic acid) as a component for imparting improved adhesion, flexibility or heat resistance, and a diazoquinone compound and/or a dihydropyridine compound as a photosensitive agent. This photo-sensitive resin composition can form a pattern of high resolution and further has excellent adhesion and mechanical properties. The present invention further provides three novel diazoquinone compounds as a photo-sensitive agent, which compounds give high resolution, high contrast and thick-film formability when compounded in a positive photo-sensitive resin composition. The present invention furthermore provides a new type positive photo-sensitive resin composition obtained by reacting a polybenzoxazole precursor with a diazoquinone compound as a photo-sensitive agent. This photo-sensitive resin composition has excellent alkali resistance when unexposed to a light and accordingly can give a high residual film ratio.
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申请公布号 |
US5449584(A) |
申请公布日期 |
1995.09.12 |
申请号 |
US19940210417 |
申请日期 |
1994.03.18 |
申请人 |
SUMITOMO BAKELITE COMPANY, LTD. |
发明人 |
BANBA, TOSHIO;TAKEUCHI, ETSU;TAKEDA, TOSHIRO;TAKEDA, NAOSHIGE;TOKOH, AKIRA |
分类号 |
G03F7/004;G03F7/022;G03F7/023;G03F7/039;G03F7/075;(IPC1-7):G03F7/023 |
主分类号 |
G03F7/004 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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