| 摘要 |
PURPOSE:To suppress the warp of the entire lead frame even if the lead frame is provided with an ultrafine pattern having weak resistance against stress by suspending the lead part from the outer frame part through a resilient arm having bend structure. CONSTITUTION:The lead frame 10 for semiconductor device comprises an outer frame part 14 having pilot holes 22 at predetermined positions on the opposite sides in the longitudinal direction of a hoop member, a pad part 18 for arranging a semiconductor element in the center of the outer frame part, a plurality of inner leads 24 extending radially from the pad part, and a lead part 16 including outer leads 26 extending outward from the edges of inner leads and parts 28, 30 for coupling the outer leads. At least one resilient arm 20 of bend structure for suspending the lead part from the outer frame part is provided at the joint of the outer frame part and the outer edge of outer lead at the lead part. |
